MiJing 3D BGA Reball Stencil for iPhone A8/A9/A10/A11/A12/A13/A14/A15

MiJing 3D BGA Reball Stencil for iPhone A8/A9/A10/A11/A12/A13/A14/A15

0.025mm thickness It is 3D. A8 contains all 6 6P BGA A9 contains all 6s 6sP A10 contains all 7 7P

A11 contains all 8 8P X 

Feature:

• Stepped groove design enables stencil to align with the tinning position of ic rapidly.
• The square holes design makes it easier to take out the formed solder balls.
• This 3D stencil is easy to use no matter you are new or an expert.
• The high success rate of planting tin, the solder balls can be formed once after you are proficient.
• This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.